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Thick Film Nickel Plating Alumina Ceramic Components For Relay
Product Details:
| Place of Origin: | China |
| Brand Name: | CMC |
| Certification: | IATF16949, ISO9001, ISO14001 |
| Model Number: | NE116 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 2000 pieces |
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| Price: | USD 1.85~4.0/piece |
| Packaging Details: | packing method is used by Plastic film,paper plate,carton and other materials |
| Delivery Time: | 15 days |
| Payment Terms: | T/T, Western Union, L/C |
| Supply Ability: | 60,000 pieces per month |
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Detail Information |
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| Material: | 95% Alumina | Color: | White |
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| Application: | Relay | Density: | 3.7g/cm3 |
| High Light: | Thick Film Nickel Plating Ceramic Components,Relay Alumina Ceramic Components,Thick Film Nickel Plating Ceramic Parts |
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Product Description
TCKT 35 Relay Ceramic Components
1. Description:
TCKT 35 Relay Ceramic Components is produced with aluminum oxide , and it has thick-film nickel plating technology on surface.It is suitable for brazing different materials such as copper and alloys.
2. Key Words:
Manufacture samples , open mould ,aluminum oxide,thick-film nickel plating technology,copper and alloys,great limberness,Good corrosion resistance,High intensity,Good high-temperature resistance performance,High purity.
3. Parameters table:
| Product Parameters | ||
| Physical Property | Material | 95% Alumina |
| Production Process | Dry Pressing | |
| Product Dimension | Per customers' drawing | |
| Density (g/cm3) | 3.70-3.75g/cm3 | |
| Water Absorption | 0% | |
| Mechanical Performance | Flexural Strength (Mpa) | 310Mpa |
| Modulus of Elasticity (Gpa) | 310Gpa | |
| Hardness (Gpa) | 12.9Gpa | |
| Poisson Ratio | 0.23 | |
| Thermal Character | Linear Thermal Expansion Coefficient | 7.2 |
| Heat Conductivity (W/mk) | 23 | |
| Electrical Property | Dielectric Constant | 9.2 |
| Dielectric Loss Tangent (x10-4) | 8 | |
| Insulation Strength (x106V/M) | 15 | |
| Metalized Ceramic Performance | Air Tightness (Pa·m3/s) | ≤10-8 |
| Bulk Resistivity (Ω·cm) | ≥1010 (20°C), ≥106 (300°C) | |
| Bonding Strength (Mpa) | ≥120Mpa | |
| Metallization Thickness (μm) | ≥20μm | |
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